Tender Details
Ref No 18105419
Document

Tender Notice

Bidding

Not specified

Short Description

Delivery Of Two Identical Advanced Surface Grinding Systems Designed Specifically For Grinding Semiconductor Substrates, Such As Gall Nitride (Gan) And Silicon Carbide (Sic).

Funding Agency
Funding Agency European Union
Deadline *
Date 14 Jul 2025
* The estimated cost, values & dates are indicative only. Please read tender document for accurate information.
Client Address
Location Poland
More Information
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