Tender Details
Ref No 20003300
Document

Tender Notice

Bidding

Not specified

Short Description

Silicon Austria Labs – Chips Ju: Wafer Reflow Vacuum Oven (Manual Or Semi-Automated)
Funding Agency
Funding Agency European Union
Deadline *
Date 30 Sep 2025
* The estimated cost, values & dates are indicative only. Please read tender document for accurate information.
Client Address
Location Austria
More Information
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