Contract Awards Details
Ref No 17955254
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International Competitive Bidding

Contract Details

Delivery Of The Device To Semi -Carbon Semiconductor Assembly Delivery Of The Device To Semi -Automatic Semi -Conductor Chip Assembly

Funding Agency
Funding Agency European Union
Contract Completion *
Date 30 Sep 2025
* The estimated cost, values & dates are indicative only. Please read tender document for accurate information.
Client Address
Location Germany
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