Contract Awards Details
Ref No 17506719
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Contract Awards

Bidding

International Competitive Bidding

Contract Details

Acquisition Of An Advanced Assembly And Integration Equipment Of Microelectronic And Photonic Circuits Of Submicrometric Scale. Advanced Alignment And Positioning Tools Of Photonic Chips. Advanced Assembly And Integration Equipment Of Microelectronic And Photonic Circuits Of Submicrometric Scale (Flip-Chip).
Funding Agency
Funding Agency European Union
Contract Completion *
Date 17 Sep 2025
* The estimated cost, values & dates are indicative only. Please read tender document for accurate information.
Client Address
Location Spain
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