Tender Details
Ref No 24890508
Notice Type

Tender Notice

Bidding

National Competitive Bidding

Short Description

Chips High-Throughput High-Resolution X-Ray Laminography/Tomography System For Advanced Packaged Semiconductor Devices And Substrates
Deadline *
Date 26 Feb 2026
* The estimated cost, values & dates are indicative only. Please read tender document for accurate information.
Client Address
Location United States
More Information
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