Tender Details
Ref No 22551709
Notice Type

Tender Notice

Bidding

National Competitive Bidding

Short Description

Micro Specimens Of Electroplated Copper Films And Micro-Sized Lead-Free Solder For Mechanical Testing To Fracture - Combined Sources Sought Notice/ Notice Of Intent To Sole Source
Deadline *
Date 03 Dec 2025
* The estimated cost, values & dates are indicative only. Please read tender document for accurate information.
Client Address
Location United States
More Information
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